Introduction to system-on-package (SOP) :miniaturization of the entire system
No. Panggil 621.381046 TUM i
Pengarang Tummala, Rao R.,; Swaminathan, Madhavan.;
Tempat Terbit New York :
Penerbit McGraw-Hill
Tahun Terbit 2008
Subject Multichip modules (Microelectronics); Microelectronic packaging.; mikroelektronika; mikroelektronik;
Klasifikasi 621.381046
Abstrak/Catatan Includes bibliographical references and index.;